As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...

Layout decomposition represents a critical step in the semiconductor manufacturing process, whereby integrated circuit designs are partitioned into multiple layers or masks to overcome the inherent ...

Applied Materials unveiled a new technology to complement ASML's EUV equipment, helping chipmakers remove the need for multiple patterning and creating economic and environmental benefits. Save my ...

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an ...

Traditional immersion lithography approached its limits years ago, and chipmakers adopted nonlitho workarounds, such as multiple patterning that uses advanced etch and deposition tools from other ...

2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...

Later this week, Imec is showing how photolithography can be used to pattern organic semiconductors and the cathode in an OLED-display stack which has the potential to eliminate the use of fine metal ...