This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...
Teasing out key trends and themes with Mark O’Shea, senior business development manager for Nordson EFD. Booth demonstrations highlighted automation, connectivity and process ...
The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as Flip Chip technology. In most cases, ...
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