Optimizing speed and time are not only the ingredients to fulfill gold medal aspirations on the Olympic track, but the prerequisites to a robust surface mount (SMT) process of memory to bottom (logic) ...

The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An ...

3-D techniques have the potential to offer a quantum leap in performance levels for advanced test and measurement equipment. Human vision and perception of the world rely on the ability to view ...

Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow ...