At SNUG India 2026 last week, one year after completing its acquisition of Ansys, Synopsys released its first Multiphysics Fusion tools, combining EDA and physics analysis technologies in a single ...

Synopsys has announced availability of its first Multiphysics Fusion product for customer deployment. As chip complexity increases, physics-related challenges including signal integrity, power ...

Physics AI models are only as good as the data used to train them, yet high-quality physics-modelling-based datasets are often scarce, expensive or difficult to obtain experimentally. In this webinar, ...

COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all physics delivers up to 5× speedups in benchmarks. COMSOL now supports GPU ...

SANTA CLARA, California, March 11 (Reuters) - Synopsys on Wednesday rolled out new software tools to handle the fast-increasing complexity of designing artificial intelligence chips, the first wave of ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...

After a long 18 months of negotiations and regulatory scrutiny, Synopsys has finalized its approximate $35 billion acquisition of Ansys. This acquisition merges two leading companies in their ...

As technologies like artificial intelligence (AI), 5G, electric vehicles, and high-speed computing continue to advance, analog and mixed-signal (AMS) technologies have become the unsung heroes of next ...

COLLEGE PARK, Md.--(BUSINESS WIRE)--IonQ (NYSE: IONQ), a leader in the quantum computing industry, and Ansys (Nasdaq: ANSS), have joined forces to integrate quantum computing into the $10B ...

Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...

Interposer on Package on PCB assembly captured for comprehensive IC to system level simulation and analysis. Ansys (2024 R2 redefines the boundaries of product design by enabling customers to move ...