Abstract: Advances in the high performance computing (HPC) lead to a new frontier of the fan out wafer level packaging (FOWLP) development. To provide a solution of cost-attractive package for ...

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

When you’ve played video games long enough, you eventually develop something of a “Spidey Sense” when you see a game that seems like it’s going to be extra special. You never know until the final ...

A game’s tutorial section is a valuable resource, but it can sometimes feel a little bit awkward. Before you launch into the depths of a big, open-world adventure, developers like to run you through a ...

Anthony is a writer who's worked in the games industry for four years. He's a competitive gamer with a soft spot for retro titles. Anthony enjoys speedrunning a few titles, but Simpson's Hit & Run is ...

Governments and humanitarian organizations need reliable data on building and infrastructure changes over time to manage urbanization, allocate resources, and respond to crises. However, many regions ...

On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand. PSMC stated that major ...

Skye Automation has devised a vision systems workaround for picking parts of varying heights. The method improves picking precision using a 2D camera integrated with a robot. That’s the problem that ...