Abstract: This paper proposes an Input-Series-Output- Parallel Phase-Shifted Full-Bridge (ISOP-PSFB) converter featuring coupled output inductors and a dual-phase-angle operation between sub-modules ...
IBM unveiled new semiconductor technology Thursday that the company says could deliver computer chips with 50% better performance while dramatically lowering power consumption. The technology ...
Abstract: As a critical component of power modules, silicone gel (SG) insulating encapsulants play a vital role in determining the operational reliability and stability through their long-term ...
ExOne launched the S-Print Pro™, a compact industrial sand 3D printer that brings production-grade binder jetting to small ...
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company ...
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