Abstract: Next generation of heterogeneous integration requires 2.5D package on interposer as enabling technology for less signal delay, faster speed, and more functionality. In this work, thermal ...
Abstract: Higher switching speed requires power module package to have lower parasitic inductance. This article summarized three methods to realize low parasitic inductance. Based on these methods, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results