Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, ...

UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...

Solderless assembly processes eliminate solder joints and enable a more integrated, fabrication-like method of system ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on Taiwan than ever.

SHENZHEN, GUANGDONG, CHINA, June 22, 2026 /EINPresswire.com/ -- In a rapidly evolving semiconductor landscape, GNS ...

Partron, a global electronics components and sensor company, and Syntiant Corp., a leading provider of full-stack, low-power physical AI solutions comprising sensors, processors and ML models, today ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...

Production-ready 3DI technology supports more compact FEMs for advanced 5G devicesMALTA, N.Y., June 23, 2026 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced the production ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...